Osaka University-Led Project Develops Next-Generation Power Devices
—Showa Denko Contributes to the Project with Its Aluminum Cooling Device Technology—
Showa Denko K.K.
July 19, 2016
A project team led by Professor Katsuaki Suganuma, Osaka University, in which Showa Denko (SDK) (TOKYO: 4004) participates, has successfully developed a hybrid circuit board structure for silicon carbide (SiC) based power devices which can stably operate even under high-temperature condition of 300oC.
This project was organized as university-industry research collaboration under the leadership of Professor Suganuma with the object of developing circuit board and packaging technologies to integrate heat-resistant SiC power devices. Professor Suganuma focused on material properties of aluminum, and developed special circuit board and packaging technologies. This newly developed package structure develops no defect even under the temperature cycle of -40oC to 300oC.
SDK has been participating in the project team, and providing the team with technologies to develop a composite of aluminum boards with insulating ceramics layer and cooling devices, technologies to solder these materials, and heat radiation design for the composite circuit board and the whole package. SDK has been developing these technologies through its operation of businesses to manufacture and market aluminum-based cooling devices and heat exchangers. In 2010, SDK was awarded the 45th Oyamada Medal from the Japan Institute for Light Metals as commendation to the development of cooling apparatus for power devices featured with these technologies.
Under the ongoing medium-term business plan “Project 2020+,” SDK has been promoting development of parts and materials for power modules. Taking advantage of its technologies to design and process diverse materials, SDK will aim to develop and offer new parts and materials for power modules with superb high-temperature tolerance and heat-dissipation efficiency, technologies to evaluate performance of power modules equipped with these parts and materials, and solution to realize downsized high-output power modules.
◆ Media contact: Public Relations Office, Showa Denko K.K. (Phone: 81-3-5470-3235)