High-Purity FC-2316 (C4F6)

About the product

Resonac’s high-purity gas used for etching insulating films in semiconductor manufacturing, and particularly suitable for etching oxide films.

FC-2316

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Merits

  • Enables high-aspect-ratio etching.
  • Boasts one of the industry’s largest production volumes and a stable supply structure supported by a strong supply chain.
  • Low global warming potential compared with other etching gases (GWP value ≦1).
  • Proven sales track record with semiconductor makers./li>
  • High-quality technical support based on extensive marketing experience.

Characteristics

Technical Data

Appearance, odor / colorless odorless gas UN number / 3160
CAS NO/685-63-2 Liquefied gas
  • Please refer to the Product Safety Data Sheet (SDS) for the gas’s detailed properties and safety data.

Physical & Chemical Properties of C4F6

Item Data
Physical state Gas
Appearance Clear and colorless
Color Clear and colorless
pH Not applicable
Melting point -132.1 ℃
Boiling point 5.4 ℃
Critical temperature 139.6 ℃
Autoignition point 490 ℃
Vapor pressure

0.178 MPa(20 ℃)

0.473 MPa(50 ℃)

Relative vapor density(20 ℃) 5.6(air = 1)
Relative density

1.434 (20 ℃) / saturation

Explosive limits (upper, lower) (g/m³)

Lower limit: 5vol %

Upper limit: 27 vol% (room temperature, 101.3kPa, in air)

Some data show the gas increases pressure, breaking down into CF4 and C (carbon) without oxygen when 11.7J energy is applied under  pressure of 0.61MPa and temperature of 60℃ by melt-cutting of nichrome wire. 

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