Ceramics Products : Filler for electoronic materials

Hexagonal Boron Nitride Powder SHOBN
fine ceramics materials
Application
Thermal Conductive Filler Raw matelial of cBN Raw matelial of hBN ceramics Release and lubricant agents
Inquiry
Ceramics Division, Marketing Department 2
TEL :81-3-5470-3434
FAX :81-3-3431-6924
alumina(roundish)
roundish alumina
Application
Thermal Conductive Filler Raw matelial of cBN Raw matelial of hBN ceramics Release and lubricant agents
Inquiry
Ceramics Division, Marketing Department 2
TEL :81-3-5470-3434
FAX :81-3-3431-6924
ALUNABEADS/CB
spherical alumina
Application
Thermal Conductive Filler for heat sink sheet, heat dissipation board, grease,adhesive, phase change sheet Filler for semiconductor sealing resin Ceramic filter
Inquiry
Ceramics Division, Marketing Department 2
TEL :81-3-5470-3434
FAX :81-3-3431-6924
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Thermal Conductive fillers Lineup

Roundish Alumina (AS Series)

The AS series is a single-grain corundum with less crystal edges. Since the AS series has a large particle diameter and broad particle size distribution, it excels at filling resin and producing compounds with low viscosity and good fluidity.

Spherical Alumina (Alunabeads™ CB Series)

Alunabeads™, also known as our CB series, is a spherical single-grained alumina. Alunabeads™ has similar characteristics to the AS series. CB produces compounds with high filling rates and good viscosity. The CB series has various particle sizes and particle distributions available.

Hexagonal Boron Nitride (SHOBN™ UHP Series)

SHOBN™, our UHP series is a high purity crystalized Hexagonal Boron Nitride. SHOBN™ has excellent thermal conductivity, high thermal stability, corrosion resistance, and good electrical characteristics (high electrical insulation, low dielectric constant). The UHP series is used for high heat radiation applications which require electrical insulation.

Comparison of thermal filler properties

Filler Shape Mean particle size Features (filler or compound property)
Roundish Alumina (AS series) Roundish 9~44μm High filling、High purity、Low abrasion、High fluidity
Spherical Alumina (Alunabeads™ CB ) Spherical 2~71μm High filling、high purity、Low abrasion、High fluidity
Hexagonal Boron Nitride( UHP series) Platelets 0.2~12μm Low specific gravity、Low abrasion、Electrical insulation、Low dielectric constant, Thermal and Chemical stability
Agglomerates Platelets properties + High loading and High density

Application examples

Thermal interface products (Sheets, Greases, Adhesives), IC circuits, etc., as an additive to various thermosetting, thermoplastic resins, rubbers, etc.

SHOWA DENKO K.K. has several Aluminum Hydroxide and Alumina products for thermal filler applications besides the products in this documents. Please contact us for more information.

Inquiry of this product
Ceramics Division, Marketing Department 2
TEL :81-3-5470-3434
FAX :81-3-3431-6924

The data shown below are representative figures. They are not guaranteed values.

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