Multi Material SolutionsFor Electric Vehicle / Power Module

Our unique multi-material solutions lead to customer values such as longer life, higher reliability and lower cost of power module.

SiC Epitaxial wafer, Cooling Device for Power Module, Molding compound for the power semiconductor, High Thermal Conductive and moisture resistance AlN Filler

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High Performance Aluminum Fin Family, Cooling Device for Power Module, SiC Epitaxial wafer, Thermal Conductive Filler for insulated TIM
* Click here for Molding compound for the power semiconductor
Click here for the detail of High Thermal Conductive and moisture resistance AlN Filler