New Technology InsightsHigh Thermal Conductive and moisture resistance AlN Filler

Our brand-new Aluminum Nitride (AlN) filler has been successfully released in the market in addition to our existing product portfolios of Aluminum Oxide (Al2O3) and Boron Nitride (BN) fillers. We also offer fillers that have excellent insulation reliability. The higher thermal conductivity helps customers for downsizing and weight reduction of power modules.

New AlN filler has excellent moisture resistance

AlN has high thermal conductivity while it is easily decomposed by moisture and generates corrosive NH3 gas. We have developed new AlN filler with excellent moisture resistance by applying original thin-layer surface treatment that prevents the chemical reaction with moisture, and it maintains its original high thermal conductivity. Our AlN filler contributes to reliability and longer life of power module with only a few of NH3 generation by 1/10,000. The higher thermal conductivity helps customers for downsizing and weight reduction of power module.

Basic properties

Ceramics thermal conductivity
Thermal conductivity of AlN is 6 times than Al2O3
 Al2O3BN (h-BN)AlN
Thermal conductivity
[W/(m・K)]
36 60 200

The data shown above are representative figures. They are not guaranteed values.

Moisture resistance property of AlN powder
NH3 concentration measurement is SDK original method
Data represents experimental results and does not guarantee specific performance levels under actual usage.

AlN filler product line-up

Powder property

Our AlN family wth excellent moisture resistance
Particle size (D50) (μm) 2 13 33 44 72
BET Specific surface area (m2/g) 2.4 0.5 0.12 0.08 0.06
Moisture resistance (NH3 concentration) (mg/L) 2 1 4 2 3

NH3 concentration measurement is SDK original method
The data shown above are representative figures. They are not guaranteed values.

Silicone sheet property

Flexible and high thermal conductive silicone sheet
 Sheet propertyMeasurement method
Sheet thickness (mm) 2 Dial Gauge
Hardness (Asker C) 23 JIS K7312
Hardness (Shore00) 57 ASTM D2240
Thermal conductivity [W/(m・K)] 12 ISO22007-2

The data shown above are representative figures. They are not guaranteed values.

SDK thermal conductive filler materials line-up

We have a rich product portfolios consisting of Al2O3, BN and AlN for insulated thermal interface materials. We can also offer fillers that has excellent insulation reliability, enhanced by reduction of voids in Thermal Interface Materials (TIM) composite with filler-blending technology and surface treatment. We can provide customers with our customization service, improving compound viscosity, voltage resistance and thermal conductivity meeting at various levels of customer’s requirement.

★Please see below for the details of Al2O3, BN filler ;
https://www.sdk.co.jp/english/products/140/145.html

Powder property
 Al2O3BN (h-BN)High moisture resistance AlN
Grade number 27 4 5
Thermal conductivity of ceramics
[W/(m・K)]
36 60 200
Fillability into resin High Low High
Moisture resistance High

The data shown above are representative figures. They are not guaranteed values.

Powder properties of various fillers
Our customization service meets your demand (Relationship between Compound viscosity and thermal conductivity)

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