New Technology InsightsHigh Thermal Conductive and moisture resistance AlN Filler
Our brand-new Aluminum Nitride (AlN) filler has been successfully released in the market in addition to our existing product portfolios of Aluminum Oxide (Al2O3) and Boron Nitride (BN) fillers. We also offer fillers that have excellent insulation reliability. The higher thermal conductivity helps customers for downsizing and weight reduction of power modules.
New AlN filler has excellent moisture resistance
AlN has high thermal conductivity while it is easily decomposed by moisture and generates corrosive NH3 gas. We have developed new AlN filler with excellent moisture resistance by applying original thin-layer surface treatment that prevents the chemical reaction with moisture, and it maintains its original high thermal conductivity. Our AlN filler contributes to reliability and longer life of power module with only a few of NH3 generation by 1/10,000. The higher thermal conductivity helps customers for downsizing and weight reduction of power module.
Basic properties
- Excellent thermal conductivity
- Improvement of moisture resistance
| Al2O3 | BN (h-BN) | AlN | |
|---|---|---|---|
| Thermal conductivity [W/(m・K)] |
36 | 60 | 200 |
The data shown above are representative figures. They are not guaranteed values.
Data represents experimental results and does not guarantee specific performance levels under actual usage.
AlN filler product line-up
Powder property
| Particle size (D50) (μm) | 2 | 13 | 33 | 44 | 72 |
|---|---|---|---|---|---|
| BET Specific surface area (m2/g) | 2.4 | 0.5 | 0.12 | 0.08 | 0.06 |
| Moisture resistance (NH3 concentration) (mg/L) | 2 | 1 | 4 | 2 | 3 |
NH3 concentration measurement is SDK original method
The data shown above are representative figures. They are not guaranteed values.
Silicone sheet property
| Sheet property | Measurement method | |
|---|---|---|
| Sheet thickness (mm) | 2 | Dial Gauge |
| Hardness (Asker C) | 23 | JIS K7312 |
| Hardness (Shore00) | 57 | ASTM D2240 |
| Thermal conductivity [W/(m・K)] | 12 | ISO22007-2 |
The data shown above are representative figures. They are not guaranteed values.
SDK thermal conductive filler materials line-up
We have a rich product portfolios consisting of Al2O3, BN and AlN for insulated thermal interface materials. We can also offer fillers that has excellent insulation reliability, enhanced by reduction of voids in Thermal Interface Materials (TIM) composite with filler-blending technology and surface treatment. We can provide customers with our customization service, improving compound viscosity, voltage resistance and thermal conductivity meeting at various levels of customer’s requirement.
★Please see below for the details of Al2O3, BN filler ;
https://www.sdk.co.jp/english/products/140/145.html
| Al2O3 | BN (h-BN) | High moisture resistance AlN | |
|---|---|---|---|
| Grade number | 27 | 4 | 5 |
| Thermal conductivity of ceramics [W/(m・K)] |
36 | 60 | 200 |
| Fillability into resin | High | Low | High | Moisture resistance | High |
The data shown above are representative figures. They are not guaranteed values.
